VERFAHREN ZUR HERSTELLUNG VON LEISTUNGSHALBLEITERMODULEN MIT ISOLIERTEM AUFBAU
A method for manufacturing insulated semiconductor power modules includes: presoldering a plurality of semiconductor sandwiches and a carrier unit including a metal base plate, ceramic insulating discs and connecting tabs with a high-melting solder in a first step; joining the semiconductor sandwich...
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Main Authors | , , |
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Format | Patent |
Language | German |
Published |
05.12.1985
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Edition | 4 |
Subjects | |
Online Access | Get full text |
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