BAUTEILVERBUND UND VERFAHREN ZUR HERSTELLUNG VON BAUTEILEN

• Main Authors: Rügheimer, Tilman, Pfeuffer, Alexander F, Schwarz, Thomas, Plößl, Andreas, Höppel, Lutz
• Format: Patent
• Language: German
• Published: 18.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

A component assembly includes an intermediate carrier, a plurality of components and a plurality of anchoring elements. The components have at least two electrical devices and an insulating layer. At least one of the electrical devices is an optoelectronic semiconductor chip. The insulating layer is...