Integriertes Modul für die Flüssigkeits-Luft-Leitung

• Main Authors: UPADHYA, GIRISH, TSAO, PAUL, MUNCH, MARK, WERNER, DOUGLAS E, HOM, JAMES, ZHOU, PEN, CONWAY, BRUCE, BREWER, RICHARD
• Format: Patent
• Language: German
• Published: 12.02.2009
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer...