Verfahren zur Herstellung von Mehrebenenkontakten durch Dimensionierung von Kontaktgrössen in integrierten Schaltungen

A method [600] for forming an integrated circuit includes etching a first opening [228] [338] [402] to a first depth in a dielectric material [322] over a semiconductor device [317] on a first semiconductor substrate [202] and etching a second opening [230] [340] [404] to a second depth in the diele...

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Bibliographic Details
Main Authors HELLIG, KAY, AMINPUR, MASSUD
Format Patent
LanguageGerman
Published 27.04.2006
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INFORMATION STORAGE
PHYSICS
SEMICONDUCTOR DEVICES
STATIC STORES
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Summary:A method [600] for forming an integrated circuit includes etching a first opening [228] [338] [402] to a first depth in a dielectric material [322] over a semiconductor device [317] on a first semiconductor substrate [202] and etching a second opening [230] [340] [404] to a second depth in the dielectric material [322] over the first semiconductor substrate [202]. The first and second openings [228] [338] [402] [230] [340] [404] are differently sized to respectively etch to the first and second depths in about the same time due to etch lag. The first and second openings [228] [338] [402] [230] [340] [404] are filled with conductive material.
Bibliography:Application Number: DE20031094263T