Verfahren zum Positionieren und Montieren einer LED-Baueinheit sowie Positionierkörper hierfür

• Main Authors: MARYSCHKA, MICHAEL, KNOLL, FRANZ, THALLER, BORIS, SVOBODNIK, GREGOR
• Format: Patent
• Language: German
• Published: 01.06.2011
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

In a method for positioning and mounting, on a carrier body (6), an LED assembly (1) preassembled on a circuit board (4), the circuit board (4) having the LED assembly (1) is placed and glued onto the carrier body (6), the LED assembly (1) being brought into the prescribed position relative to the c...