ELECTRONIC ASSEMBLY WITH COMPRESSIBLE STRUCTURE OF RADIATOR
An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deform...
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Main Authors | , |
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Format | Patent |
Language | Czech English |
Published |
11.11.1998
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Edition | 6 |
Subjects | |
Online Access | Get full text |
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Abstract | An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling. |
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AbstractList | An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable manner using a plurality of compressible, thermally conductive members (e.g., solder balls). These members are compressed and permanently deformed as part of the thermal coupling. |
Author | SATHE SANJEEV BALWANT ALCOE DAVID JAMES |
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DocumentTitleAlternate | Elektronická sestava se stlačitelnou strukturou chladiče |
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Notes | Application Number: CZ19970003638 |
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RelatedCompanies | INTERNATIONAL BUSINESS MACHINES CORPORATION |
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Snippet | An electronic package wherein an electronic device (e.g., chip) on a circuitized substrate of the package is thermally coupled to a heatsink in a separable... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | ELECTRONIC ASSEMBLY WITH COMPRESSIBLE STRUCTURE OF RADIATOR |
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