Processor socket with buffer and heat radiating effect

• Main Author: HUANGZHOU HUANG
• Format: Patent
• Language: English
• Published: 20.12.2006
• Subjects: BASIC ELECTRIC ELEMENTS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; SEMICONDUCTOR DEVICES

The utility model relates to a processor socket with buffer and heat radiating effect, which comprises a base, a protective cover, a heat radiation plate and a plurality of fixing components, wherein the base is arranged on a system board. The base is formed with a containing chamber, the bottom of the containing chamber is provided with a plurality of rows of elastic metal terminals, each row respectively comprises a plurality of metal terminals and a plurality of elastic components are arranged in the containing chamber. The protective cover is arranged on the top end of the elastic component and can vertically slide in the containing chamber, the protective cover is formed with a plurality of penetration terminal slots side by side and the corresponding rows of terminals can respectively penetrate through the penetration terminal slots. The heat radiation plate is arranged on the base and can be in contact with a processor arranged in the containing chamber of the base. The fixing components can fix the heat radiation plate on the base. The utility model can install the processor to the socket and can avoid the downward strength of the processor from crushing the metal terminals in the socket, and the socket can also radiate the heat of the processor after installing the processor.