Inner-layer circuit board punching machine

• Main Author: HUO JINCHONG
• Format: Patent
• Language: Chinese; English
• Published: 05.07.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CUTTING; CUTTING-OUT; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HAND CUTTING TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORATING; PERFORMING OPERATIONS; PRINTED CIRCUITS; PUNCHING; SEVERING; SEVERING BY MEANS OTHER THAN CUTTING; STAMPING-OUT; TRANSPORTING

The utility model discloses an inner-layer circuit board punching machine. A feeding device comprises a rack, a blowing platform mechanism, a first vacuum suction mechanism arranged above the blowing platform mechanism and a first driving mechanism for driving the first vacuum suction mechanism to move. The air blowing platform mechanism is provided with a plane without preformed holes, and a plurality of air blowing holes are formed in the plane. The first vacuum suction mechanism is arranged above the blowing platform mechanism, so that a preformed hole does not need to be formed in the plane for the first vacuum suction mechanism, that is, the plane is of a relatively complete flat plate structure, that is, a traditional preformed hole with a relatively large area is omitted, and therefore, the production efficiency is improved. The problem that the edge of the inner-layer circuit board is folded downwards at the position of the reserved hole in the inner-layer circuit board conveying process is avoided, s