Stamping die for electronic packaging chip

• Main Authors: SUN XINYU, WU XINFENG, ZHA LIUHUA, XING FENG
• Format: Patent
• Language: Chinese; English
• Published: 24.05.2024
• Subjects: MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; PERFORMING OPERATIONS; PUNCHING METAL; TRANSPORTING; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL

The utility model belongs to the technical field of stamping dies, and discloses an electronic packaging sheet stamping die which comprises a hydraulic connecting column, the hydraulic connecting column is fixedly connected with external hydraulic equipment, the lower surface of the hydraulic connec...