Stamping die for electronic packaging chip

• Main Authors: SUN XINYU, WU XINFENG, ZHA LIUHUA, XING FENG
• Format: Patent
• Language: Chinese; English
• Published: 24.05.2024
• Subjects: MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; PERFORMING OPERATIONS; PUNCHING METAL; TRANSPORTING; WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL

The utility model belongs to the technical field of stamping dies, and discloses an electronic packaging sheet stamping die which comprises a hydraulic connecting column, the hydraulic connecting column is fixedly connected with external hydraulic equipment, the lower surface of the hydraulic connecting column is fixedly connected with an upper sliding plate, the lower surface of the upper sliding plate is fixedly connected with a stamping plate, and the stamping plate is fixedly connected with an upper sliding plate. A stamping head is fixedly connected to the lower surface of the stamping plate, a lower supporting plate is arranged below the stamping plate, connecting rods and a waste collecting box are fixedly connected to the upper surface of the lower supporting plate, the connecting rods are located at the four corners of the waste collecting box, and slotted holes allowing the connecting rods to slide are formed in the upper sliding plate. By means of the sliding clamping structure, people can freely a