Cutting mechanism, cutting device and battery manufacturing equipment

• Main Authors: XU YANG, YAN ZHIQIANG, SHI JIANXIANG, SUN JIANXIANG
• Format: Patent
• Language: Chinese; English
• Published: 17.05.2024
• Subjects: CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

The utility model provides a cutting mechanism, a cutting device and battery manufacturing equipment, the cutting mechanism comprises a fixing assembly and a cutting assembly, the fixing assembly is used for fixing a to-be-cut adhesive tape; the cutting assembly comprises a laser device which is used for irradiating laser beams to the surface of the adhesive tape so as to cut the adhesive tape. In the embodiment of the invention, the laser is used for cutting the adhesive tape, on one hand, the laser beam does not have a body capable of carrying objects, and the laser beam can not be bonded by glue; and secondly, the high temperature can burn the glue, so that the glue agglomeration at the cutting part can be avoided, the maintenance frequency of the adhesive tape cutting mechanism can be reduced, the working efficiency of the adhesive tape cutting operation is improved, and the high-efficiency battery production operation is facilitated. 本申请提供了一种裁切机构、裁切装置以及电池制造设备，裁切机构，包括固定组件和裁切组件，其中，固定组件用于将待裁切的胶带固定；裁切组件包括激光器