Surface acoustic wave filter packaging structure

• Main Authors: DOU YUNXUAN, XU JIAYU, JIANG YUNWU, QIAN CHEN, LI NA, ZANG SHOUBING
• Format: Patent
• Language: Chinese; English
• Published: 29.03.2024
• Subjects: BASIC ELECTRONIC CIRCUITRY; ELECTRICITY; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS

The utility model discloses a surface acoustic wave filter packaging structure, which belongs to the technical field of filters and is used for solving the problem that the defective rate is high in the production process due to the fact that resin is easy to overflow to a functional area of a filter chip in the packaging process of the filter chip. Comprising a base body, a chip is fixedly connected to the middle of the upper surface of the base body through an electric conductor, sealing plates abut against the lower ends of the front, back, left and right of the chip, a packaging body is arranged on the periphery of the upper surface of the base body, the chip is arranged in the packaging body in a covering mode, and telescopic connecting rods are arranged on the sides, away from the chip, of the four sealing plates. The circumferential surfaces of the four telescopic connecting rods are all sleeved with compression springs. Through the sealing plate and the pressure spring arranged in the base body, the s