Fan-out packaging structure of high-power chip based on resin base

• Main Authors: WANG CHENGQIAN, LIU YIHAN, DAI FEIHU
• Format: Patent
• Language: Chinese; English
• Published: 13.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a fan-out packaging structure of a high-power chip based on a resin base, which belongs to the field of integrated circuit packaging and comprises a high-power chip, an additive layer, a plastic packaging material, a dielectric layer, a conductive through hole, a rewiring layer, a passivation layer and salient points. The additive layer is arranged on the back surface of the high-power chip, and the plastic package material completely wraps the high-power chip and the additive layer to form a resin substrate; the dielectric layer covers the front surface of the resin substrate, a conductive through hole and a rewiring layer are arranged on the dielectric layer through a patterning technology, and the rewiring layer realizes lead-out of a chip active surface signal end through the conductive through hole; the passivation layer covers the surface of the rewiring layer, an opening is formed by adopting a patterning technology, and the salient point is manufactured at the opening by ad