Automatic heat dissipation device for bus duct

The utility model relates to the technical field of bus duct heat dissipation, in particular to an automatic heat dissipation device for a bus duct, which comprises a heat dissipation group, the bottom of the heat dissipation group is fixedly connected with the top of a duct body, the heat dissipati...

Full description

Saved in:
Bibliographic Details
Main Authors DU NIAN, LIU CHANGXIONG, LI DONG
Format Patent
LanguageChinese
English
Published 04.08.2023
Subjects
Online AccessGet full text

Cover

Loading…
Abstract The utility model relates to the technical field of bus duct heat dissipation, in particular to an automatic heat dissipation device for a bus duct, which comprises a heat dissipation group, the bottom of the heat dissipation group is fixedly connected with the top of a duct body, the heat dissipation group comprises a heat conducting sheet attached to the top of the duct body, and the top of the heat conducting sheet is fixedly connected with the bottom of a top heat dissipation plate. A heat dissipation groove is formed in the top of the top heat dissipation plate, a heat dissipation cover plate is embedded in the heat dissipation groove, and the bottom of the heat conduction sheet is fixedly connected with the top of the bottom heat dissipation plate. The heat dissipation plate is provided with the concave heat dissipation grooves, so that the heat dissipation area is increased, the grooves can help air to rapidly circulate and prevent moisture from staying, and the moisture is prevented from influencing t
AbstractList The utility model relates to the technical field of bus duct heat dissipation, in particular to an automatic heat dissipation device for a bus duct, which comprises a heat dissipation group, the bottom of the heat dissipation group is fixedly connected with the top of a duct body, the heat dissipation group comprises a heat conducting sheet attached to the top of the duct body, and the top of the heat conducting sheet is fixedly connected with the bottom of a top heat dissipation plate. A heat dissipation groove is formed in the top of the top heat dissipation plate, a heat dissipation cover plate is embedded in the heat dissipation groove, and the bottom of the heat conduction sheet is fixedly connected with the top of the bottom heat dissipation plate. The heat dissipation plate is provided with the concave heat dissipation grooves, so that the heat dissipation area is increased, the grooves can help air to rapidly circulate and prevent moisture from staying, and the moisture is prevented from influencing t
Author LI DONG
LIU CHANGXIONG
DU NIAN
Author_xml – fullname: DU NIAN
– fullname: LIU CHANGXIONG
– fullname: LI DONG
BookMark eNrjYmDJy89L5WTQcywtyc9NLMlMVshITSxRSMksLs4sAPLz8xRSUssyk1MV0vKLFJJKixVSSpNLeBhY0xJzilN5oTQ3g5Kba4izh25qQX58anFBYnJqXmpJvLOfkaGlibm5qalBaKgxUYoASsMtGA
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate 一种用于母线槽自动散热装置
ExternalDocumentID CN219477550UU
GroupedDBID EVB
ID FETCH-epo_espacenet_CN219477550UU3
IEDL.DBID EVB
IngestDate Fri Jul 19 13:59:48 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN219477550UU3
Notes Application Number: CN202320216458U
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230804&DB=EPODOC&CC=CN&NR=219477550U
ParticipantIDs epo_espacenet_CN219477550UU
PublicationCentury 2000
PublicationDate 20230804
PublicationDateYYYYMMDD 2023-08-04
PublicationDate_xml – month: 08
  year: 2023
  text: 20230804
  day: 04
PublicationDecade 2020
PublicationYear 2023
RelatedCompanies SICHUAN XINXI HIGH ELECTRIC CO., LTD
RelatedCompanies_xml – name: SICHUAN XINXI HIGH ELECTRIC CO., LTD
Score 3.6168616
Snippet The utility model relates to the technical field of bus duct heat dissipation, in particular to an automatic heat dissipation device for a bus duct, which...
SourceID epo
SourceType Open Access Repository
SubjectTerms CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRICITY
GENERATION
INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES
Title Automatic heat dissipation device for bus duct
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230804&DB=EPODOC&locale=&CC=CN&NR=219477550U
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3fS8MwED7mFOebTsU5lSDSt-pqk9Y-FHFpyxDWDVllb2NZUtQHN2yL4F_vJXTOp72FBPLjji93Se6-ANxQNVcsyJkdBFLYFJVuY4HZjpK-J3pzV_Z07vAw9QYZfZ6yaQM-1rkwhif025AjIqIWiPfS7NerzSVWZGIrizvxjlXLx2QSRlZ9OkZ_-gGVHvXDeDyKRtziPOSplb5oYFLfR3c824FddKN9jYb4ta-zUlb_TUpyCHtj7O2zPILGz1sbWnz981ob9of1gzcWa-wVx3D7VJVLQ7BK9AZK9Et6HQ9NpNKAJ-iAElEVRHO4nsB1Ek_4wMaBZ3-rnPF0M8fMPYUmHv_VGRA0yVTk94EnpY5hWQTUU8rJHV94rmJSdaC7paPzra1dONBCMwFt9AKa5VelLtHIluLKSOcXt0WBEQ
link.rule.ids 230,309,783,888,25576,76882
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dT8IwEL8gGvFNUaPiR2PM3qYMuo09ECMdy1Q2iNkMb4TSLuqDEDdi4l_vtRniE2-XNrl-5de7a-8D4IbKqbS9zDY9T3CT4qGbSNimJYXr8Oa0LZoqdjiKnTClT2N7XIGPVSyMzhP6rZMjIqJmiPdC39eL9SOWr30r8zv-jk3z-yDp-kZpHaM-3cFD93vd_mjoD5nBWJfFRvyigEldF9XxdAu2UcXuqGoH_deeikpZ_BcpwT7sjJDbZ3EAlZ-3OtTYqvJaHXaj8sMbyRJ7-SHcPiyLuU6wStQFStRPeukPTYRUgCeogBK-zInK4XoE10E_YaGJA0_-Vjlh8XqOafsYqmj-yxMgKJIpz1qeI4TyYZl51JHSyiyXO21pC3kKjQ2Mzjb2XkEtTKLBZPAYPzdgT22gdm6j51AtvpbyAgVuwS_1Tv0C7FGEAQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Automatic+heat+dissipation+device+for+bus+duct&rft.inventor=DU+NIAN&rft.inventor=LIU+CHANGXIONG&rft.inventor=LI+DONG&rft.date=2023-08-04&rft.externalDBID=U&rft.externalDocID=CN219477550UU