Wafer box

• Main Authors: HONG QINGFU, FANG QIANG, HE QIAN, WANG WENBIN, ZUO ZHIGANG, LIU HONGWEI
• Format: Patent
• Language: Chinese; English
• Published: 30.05.2023
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a wafer box, and belongs to the technical field of wafer packaging. Comprising a shell, the inner section of the shell is of a trapezoidal structure, the width of the top end of the shell is larger than that of the bottom end of the shell, the bottom end and the top end of the shell are each provided with an opening, a plurality of first clamping grooves are formed in the first side wall of the shell, a plurality of second clamping grooves are formed in the second side wall of the shell, and the first side wall and the second side wall are oppositely arranged; the first clamping grooves and the second clamping grooves are in one-to-one correspondence, the corresponding first clamping grooves and second clamping grooves are respectively used for clamping two opposite sides of the same wafer, and the width of the first clamping grooves and the width of the second clamping grooves are matched with the thickness of the wafer; the blocking frame is detachably arranged at the top end of