Sensor support with heat dissipation function

• Main Author: DONG JINFA
• Format: Patent
• Language: Chinese; English
• Published: 26.05.2023
• Subjects: ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVEREDIN A SINGLE OTHER SUBCLASS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR; PHYSICS; PRINTED CIRCUITS; TARIFF METERING APPARATUS; TESTING

The utility model provides a sensor support with a heat dissipation function, which comprises a movable frame, and the movable frame is connected with a self-adaptive adjusting rod structure, a rapid heat dissipation cooling fin structure and a movable adjusting support rod structure, a movable clam...