Efficient heat dissipation structure of mobile phone mainboard

• Main Author: QIU ZHONGHUA
• Format: Patent
• Language: Chinese; English
• Published: 14.03.2023
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TELEPHONIC COMMUNICATION

The efficient heat dissipation structure comprises a main core plate and an anti-jamming device, side plates are arranged at the left end and the right end of the main core plate, mounting holes are formed in the four corners of each side plate, and buffer assemblies used for buffering external force to extrude the main plate are mounted at the ends, close to the mounting holes, of the side plates. The buffer assembly comprises a double-faced adhesive tape, a first rubber damping strip block and a supporting convex particle, the first rubber damping strip block is arranged on the surface of the double-faced adhesive tape, the supporting convex particle is installed on the surface of the first rubber damping strip block, the anti-jamming device is located on the surface of the main core plate, and second rubber damping strip blocks are arranged at the upper end and the lower end of the surface of the main core plate. According to the efficient heat dissipation structure of the mobile phone mainboard, external