Novel high-thermal-conductivity aluminum-based circuit board

• Main Author: YE HAOXUAN
• Format: Patent
• Language: Chinese; English
• Published: 18.10.2022
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a novel high thermal conductivity aluminum-based circuit board, which comprises an aluminum-based circuit board, a plurality of rectangular openings are arranged on the aluminum-based circuit board, connecting plates are arranged in the rectangular openings through torsio...