Radio frequency device

According to the radio frequency device provided by the invention, the two radio frequency modules are integrated into one packaging structure, and then the packaging structure and the modem are arranged on the same carrier plate, so that the signal path from the radio frequency modules to the modem...

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Bibliographic Details
Main Author LIN, CHENG-NAN
Format Patent
LanguageChinese
English
Published 12.08.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
TRANSMISSION
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Summary:According to the radio frequency device provided by the invention, the two radio frequency modules are integrated into one packaging structure, and then the packaging structure and the modem are arranged on the same carrier plate, so that the signal path from the radio frequency modules to the modem can be effectively shortened, the signal loss is reduced, and the signal quality is improved; and the transmission distance in the vertical direction is no longer limited by the thickness of the interposer between the support plates. 本申请提出了一种射频装置，通过将两个射频模组整合到一个封装结构中，再与调制解调器设置在同一载板上，可以有效缩短射频模组到调制解调器的信号路径，减少信号损耗，提高信号品质，并使垂直方向上的传输距离不再受限于载板之间中介层的厚度。
Bibliography:Application Number: CN202220862302U