Edge magnetic device for semiconductor process equipment and semiconductor process equipment

• Main Authors: ZHANG HENGSHENG, ZHANG TONGWEN, WANG KUANMAO
• Format: Patent
• Language: Chinese; English
• Published: 22.02.2022
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The utility model discloses an edge magnetic device for semiconductor processing equipment and the semiconductor processing equipment, and relates to the technical field of semiconductor processing equipment. The edge magnetic device comprises a shell assembly, a cover body and a magnetic piece, the shell assembly is provided with a containing cavity and an opening, and the magnetic piece is arranged in the containing cavity; the cover body and the shell can move relatively, and under the condition that the cover body covers the shell assembly, a magnetic field generated by the magnetic piece is shielded in the containing cavity; and under the condition that the cover body is far away from the shell assembly, the magnetic piece is used for providing a bias magnetic field for the process chamber. According to the scheme, the problem that the edge magnet needs to be disassembled and assembled repeatedly in the process of manufacturing the barrier layer of the two-layer structure can be solved. 本实用新公开一种用于半导体工艺设备