Thick-film wafer resistor
The utility model discloses a thick film wafer resistor. Chassis, front panels are fixedly mounted on the front side and the rear side of the surface of the bottom frame. Side plates are fixedly mounted on the left and right sides of the surface of the underframe; sliding frames are fixedly mounted...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
01.12.2020
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Subjects | |
Online Access | Get full text |
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Abstract | The utility model discloses a thick film wafer resistor. Chassis, front panels are fixedly mounted on the front side and the rear side of the surface of the bottom frame. Side plates are fixedly mounted on the left and right sides of the surface of the underframe; sliding frames are fixedly mounted at the upper ends of the two front panels of the two side plates; lifting plates are connected intothe two front panels and the two side plates in an up-and-down sliding manner; a mounting plate is fixedly mounted on the surface of the lifting plate; a wafer is embedded in the surface of the mounting plate; according to the utility model, the protection structure is arranged outside the chip resistor; pROTECTION OF RESISTORS, so that it is not easy to damage, the design of the device is ingenious, when the external protection structure is unfolded, the lower lifting plate is lifted up, later use of the resistor is facilitated, the cooling fans are arranged on the back face of the dust shielding plate, the cooling f |
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AbstractList | The utility model discloses a thick film wafer resistor. Chassis, front panels are fixedly mounted on the front side and the rear side of the surface of the bottom frame. Side plates are fixedly mounted on the left and right sides of the surface of the underframe; sliding frames are fixedly mounted at the upper ends of the two front panels of the two side plates; lifting plates are connected intothe two front panels and the two side plates in an up-and-down sliding manner; a mounting plate is fixedly mounted on the surface of the lifting plate; a wafer is embedded in the surface of the mounting plate; according to the utility model, the protection structure is arranged outside the chip resistor; pROTECTION OF RESISTORS, so that it is not easy to damage, the design of the device is ingenious, when the external protection structure is unfolded, the lower lifting plate is lifted up, later use of the resistor is facilitated, the cooling fans are arranged on the back face of the dust shielding plate, the cooling f |
Author | LIU YADAN CUI HUAYANG JIANG LIMIN |
Author_xml | – fullname: CUI HUAYANG – fullname: LIU YADAN – fullname: JIANG LIMIN |
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Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 一种厚膜晶片电阻器 |
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Notes | Application Number: CN202020833233U |
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RelatedCompanies | XINHUA HEANSHENG ELECTRONIC TECHNOLOGY CO., LTD |
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Snippet | The utility model discloses a thick film wafer resistor. Chassis, front panels are fixedly mounted on the front side and the rear side of the surface of the... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRICITY RESISTORS |
Title | Thick-film wafer resistor |
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