Flexible plate printing backflow carrier

• Main Authors: FU XIANGCHENG, DING JIANQIN
• Format: Patent
• Language: Chinese; English
• Published: 29.09.2020
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Reflow soldering is an essential process in SMT (Surface Mount Technology) production, and in order to prevent an FPC (Flexible Printed Circuit) from deviating or deforming, the FPC is usually mountedon a reflow carrier. According to an existing SMT printing backflow carrier, the placement position...