Chip packaging structure adopting multi-base island lead frame

• Main Authors: XU PENG, LI YANGDE, ZHOU ZHANRONG
• Format: Patent
• Language: Chinese; English
• Published: 11.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The utility model discloses a chip packaging structure adopting a multi-base island lead frame, which is characterized in that a double-N substrate diode and a double-P substrate diode are respectively placed on two different base islands to form a diode bridge rectifier; compared with a traditional four-independent-diode bridge rectifier, the scheme is simpler to implement, easier to operate andlower in cost. 本实用新型公开了一种采用多基岛引线框架的芯片封装结构，通过将一颗双N衬底二极管和一颗双P衬底二极管分别放在两个不同基岛上，组成二极管整流桥堆；相比传统的四颗独立二极管整流桥堆，该方案实现更简单、操作更容易、成本更低。