APA (7th ed.) Citation

PENG, X., YANGDE, L., & ZHANRONG, Z. (2020). Chip packaging structure adopting multi-base island lead frame.

Chicago Style (17th ed.) Citation

PENG, XU, LI YANGDE, and ZHOU ZHANRONG. Chip Packaging Structure Adopting Multi-base Island Lead Frame. 2020.

MLA (9th ed.) Citation

PENG, XU, et al. Chip Packaging Structure Adopting Multi-base Island Lead Frame. 2020.