Novel heat dissipation copper fin

• Main Author: ZHANG LINPIN
• Format: Patent
• Language: Chinese; English
• Published: 03.12.2019
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a novel heat dissipation copper fin. Fixed bottom plate, a first connecting plate is arranged above the fixed bottom plate. First heat dissipation single pieces are arranged at the upper end of the fixed bottom plate and below the first connecting plate. A second heat dis...