Semiconductor structure and test system

The utility model discloses a semiconductor structure and a test system. The semiconductor structure includes: a substrate; the doped layer is formed on the first surface of the substrate; and a plurality of trenches, each groove penetrates through the doped layer and extends into the substrate; whe...

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Main Authors LI JINGYI, ZHOU YUAN, ZHANG XIAOLIN, ZHU LINDI, ZHANG ZHIWEN, WANG CHAO, PEI ZIWEI
Format Patent
LanguageChinese
English
Published 24.09.2019
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Abstract The utility model discloses a semiconductor structure and a test system. The semiconductor structure includes: a substrate; the doped layer is formed on the first surface of the substrate; and a plurality of trenches, each groove penetrates through the doped layer and extends into the substrate; wherein the plurality of grooves comprise at least one first groove and at least one second groove, each second groove is used for forming a grid electrode of the corresponding semiconductor device, and each first groove defines and isolates the test region with a closed-loop boundary in the doped layer. According to the semiconductor structure, the test region is formed while the semiconductor device is formed, and the test region comprises the doped layer and the first groove penetrating through the doped layer, so that the doped layer has a clear boundary, key parameters such as body region resistance of the semiconductor device can be more accurately represented, and the yield and reliability of products are impro
AbstractList The utility model discloses a semiconductor structure and a test system. The semiconductor structure includes: a substrate; the doped layer is formed on the first surface of the substrate; and a plurality of trenches, each groove penetrates through the doped layer and extends into the substrate; wherein the plurality of grooves comprise at least one first groove and at least one second groove, each second groove is used for forming a grid electrode of the corresponding semiconductor device, and each first groove defines and isolates the test region with a closed-loop boundary in the doped layer. According to the semiconductor structure, the test region is formed while the semiconductor device is formed, and the test region comprises the doped layer and the first groove penetrating through the doped layer, so that the doped layer has a clear boundary, key parameters such as body region resistance of the semiconductor device can be more accurately represented, and the yield and reliability of products are impro
Author LI JINGYI
ZHANG XIAOLIN
ZHANG ZHIWEN
ZHU LINDI
PEI ZIWEI
ZHOU YUAN
WANG CHAO
Author_xml – fullname: LI JINGYI
– fullname: ZHOU YUAN
– fullname: ZHANG XIAOLIN
– fullname: ZHU LINDI
– fullname: ZHANG ZHIWEN
– fullname: WANG CHAO
– fullname: PEI ZIWEI
BookMark eNrjYmDJy89L5WRQD07NzUzOz0spTS7JL1IoLikCMkqLUhUS81IUSlKLSxSKK4tLUnN5GFjTEnOKU3mhNDeDkptriLOHbmpBfnxqcUFicmpeakm8s5-RgaWJsYmhiWVoqDFRigAgdSsQ
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
DocumentTitleAlternate 半导体结构及测试系统
ExternalDocumentID CN209434149UU
GroupedDBID EVB
ID FETCH-epo_espacenet_CN209434149UU3
IEDL.DBID EVB
IngestDate Fri Jul 19 16:14:12 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language Chinese
English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN209434149UU3
Notes Application Number: CN201821898448U
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&CC=CN&NR=209434149U
ParticipantIDs epo_espacenet_CN209434149UU
PublicationCentury 2000
PublicationDate 20190924
PublicationDateYYYYMMDD 2019-09-24
PublicationDate_xml – month: 09
  year: 2019
  text: 20190924
  day: 24
PublicationDecade 2010
PublicationYear 2019
RelatedCompanies BEIJING YANDONG MICROELECTRONICS TECHNOLOGY CO., LTD
RelatedCompanies_xml – name: BEIJING YANDONG MICROELECTRONICS TECHNOLOGY CO., LTD
Score 3.3512988
Snippet The utility model discloses a semiconductor structure and a test system. The semiconductor structure includes: a substrate; the doped layer is formed on the...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Semiconductor structure and test system
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190924&DB=EPODOC&locale=&CC=CN&NR=209434149U
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsbAwSbJITjbRTTGxSNMFlpIWukmGxqm6SeapwNg2sExJA28S8_Uz8wg18YowjWBiyILthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xsHYD9ifUXJxsXQP8Xfyd1ZydbZ391PyCgHKgg9CA3YFQZgZWUDMadM6-a5gTaFdKAXKV4ibIwBYANC2vRIiBqSpDmIHTGXbzmjADhy90whvIhOa9YhEG9WDQOvb8PNABrflFCpCDX0uLUhUS81IUgA3GEgXIqcyiDEpuriHOHrpAG-Ph3ot39kM4LtRYjIEF2O9PlWBQALaFzJITTYGlQIqFCbBcSkwzSjYxTDZINDMDZiqzJEkGaTwGSeGVlWbgAoWWLnh6RYaBBejkVFlg7VqSJAcOFgAzJn4X
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQsbAwSbJITjbRTTGxSNMFlpIWukmGxqm6SeapwNg2sExJA28S8_Uz8wg18YowjWBiyILthQGfE1oOPhwRmKOSgfm9BFxeFyAGsVzAayuL9ZMygUL59m4hti5q0N4xsHYD9ifUXJxsXQP8Xfyd1ZydbZ391PyCgHKgg9CA3YFQZgZWc2CXENxVCnMC7UopQK5S3AQZ2AKApuWVCDEwVWUIM3A6w25eE2bg8IVOeAOZ0LxXLMKgHgxax56fBzqgNb9IAXLwa2lRqkJiXooCsMFYogA5lVmUQcnNNcTZQxdoYzzce_HOfgjHhRqLMbAA-_2pEgwKwLaQWXKiKbAUSLEwAZZLiWlGySaGyQaJZmbATGWWJMkgjccgKbyy8gycHiG-PvE-nn7e0gxcoJDTBU-1yDCwAJ2fKgusaUuS5MBBBAA87IEB
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Semiconductor+structure+and+test+system&rft.inventor=LI+JINGYI&rft.inventor=ZHOU+YUAN&rft.inventor=ZHANG+XIAOLIN&rft.inventor=ZHU+LINDI&rft.inventor=ZHANG+ZHIWEN&rft.inventor=WANG+CHAO&rft.inventor=PEI+ZIWEI&rft.date=2019-09-24&rft.externalDBID=U&rft.externalDocID=CN209434149UU