Wafer bonded tool

The utility model discloses a wafer bonded tool, its including the seat of honour of mutually supporting with lower, its middle zone is used for placing the bonding wafer, its characterized in that: a platband positioner and a wafer reference column of taking flexible coefficient is set for along th...

Full description

Saved in:
Bibliographic Details
Main Authors HAN XUESONG, XIE CHUANGYU, WANG DUXIANG, MA ZHIBANG, WU CHAOYU
Format Patent
LanguageEnglish
Published 19.08.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The utility model discloses a wafer bonded tool, its including the seat of honour of mutually supporting with lower, its middle zone is used for placing the bonding wafer, its characterized in that: a platband positioner and a wafer reference column of taking flexible coefficient is set for along the department to the outer of a lower upper surface, the wafer reference column is located the distal end of platband positioner position. At the platband positioner that tool edge increase has the coefficient of elasticity, make adhesive wafer platband and the contact of platband positioner during the bonded operation, fix into a stable structure through the device that has the coefficient of elasticity with locator -wafer platband distal end reference column to the bonding wafer rotation misplaces under preventing the high temperature high pressure.
Bibliography:Application Number: CN20152289827U