High-density interconnect circuit board solder recovery device
The utility model relates to a solder recovery device for a printed circuit board solder coating process, and particularly discloses a high-density interconnection circuit board solder recovery device which comprises a recovery box, wherein a flow guide groove which extends towards the outer side is...
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Format | Patent |
Language | English |
Published |
18.03.2015
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Subjects | |
Online Access | Get full text |
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Abstract | The utility model relates to a solder recovery device for a printed circuit board solder coating process, and particularly discloses a high-density interconnection circuit board solder recovery device which comprises a recovery box, wherein a flow guide groove which extends towards the outer side is formed in one side edge of the upper end of the recovery box, and is used for communicating a liquid flowing opening of a solder coating machine; a hook for clamping a solder pot is arranged at the upper end of the side edge of the recovery box on each of the two sides of the flow guide groove; an overflow opening is formed in the upper edge of the side edge of the other side, opposite to the flow guide groove, of the recovery box, and the lower edge of the overflow opening is lower than the upper edge of the recovery box. According to the device, the flow guide groove of the recovery box is communicated with the liquid flowing opening of the solder coating machine, effective solder mixed with waste soldering flux can be guided into the recovery box for collection, and the waste soldering flux can be guided out of the recovery box to be separated from the effective solder by the overflow opening in the front end face of the recovery box; the hooks and a support rib of the recovery box are matched with a lifting ring, so that the recovery box can be conveniently mounted and put away, and the working efficiency of recovery box replacement is improved. |
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AbstractList | The utility model relates to a solder recovery device for a printed circuit board solder coating process, and particularly discloses a high-density interconnection circuit board solder recovery device which comprises a recovery box, wherein a flow guide groove which extends towards the outer side is formed in one side edge of the upper end of the recovery box, and is used for communicating a liquid flowing opening of a solder coating machine; a hook for clamping a solder pot is arranged at the upper end of the side edge of the recovery box on each of the two sides of the flow guide groove; an overflow opening is formed in the upper edge of the side edge of the other side, opposite to the flow guide groove, of the recovery box, and the lower edge of the overflow opening is lower than the upper edge of the recovery box. According to the device, the flow guide groove of the recovery box is communicated with the liquid flowing opening of the solder coating machine, effective solder mixed with waste soldering flux can be guided into the recovery box for collection, and the waste soldering flux can be guided out of the recovery box to be separated from the effective solder by the overflow opening in the front end face of the recovery box; the hooks and a support rib of the recovery box are matched with a lifting ring, so that the recovery box can be conveniently mounted and put away, and the working efficiency of recovery box replacement is improved. |
Author | HAO BAOJUN |
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RelatedCompanies | TIANJIN PRINTRONICS CIRCUIT CORP |
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Snippet | The utility model relates to a solder recovery device for a printed circuit board solder coating process, and particularly discloses a high-density... |
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SubjectTerms | CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
Title | High-density interconnect circuit board solder recovery device |
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