Circuit board soldering tin combining structure
The utility model discloses a circuit board soldering tin combining structure comprising a first circuit board and a second circuit board. The first circuit board comprises a first insulating layer and a plurality of first bonding pads disposed on the inner surface of the first insulating layer side...
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Main Author | |
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Format | Patent |
Language | Chinese English |
Published |
19.11.2014
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Subjects | |
Online Access | Get full text |
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