Circuit board soldering tin combining structure

• Main Author: PENG YINGHUA
• Format: Patent
• Language: Chinese; English
• Published: 19.11.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model discloses a circuit board soldering tin combining structure comprising a first circuit board and a second circuit board. The first circuit board comprises a first insulating layer and a plurality of first bonding pads disposed on the inner surface of the first insulating layer side by side at intervals. The second circuit board comprises a second insulating layer and a plurality of second bonding pads disposed on the inner surface of the second insulating layer side by side at intervals. The first bonding pads and the second bonding pads correspond in positions and are combined through solder paste. The first circuit board is equipped with a plurality of through holes passing through the first insulating layer and the first bonding pads. The solder paste is injected into the through holes. The through holes are arranged on the first circuit board such that the solder paste may permeate the through holes and can be observed from a position over the through holes. Thus, poor soldering can be d