Sacrificial stress-reduction wafer level chip scale packaging structure
The utility model discloses a wafer level chip scale packaging structure, and is a sacrificial stress-reduction wafer level chip scale packaging structure. According to the packaging structure, first, at least three through holes are machined on a passivation layer in positions corresponding to pins...
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Main Authors | , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
05.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The utility model discloses a wafer level chip scale packaging structure, and is a sacrificial stress-reduction wafer level chip scale packaging structure. According to the packaging structure, first, at least three through holes are machined on a passivation layer in positions corresponding to pins to partly expose the pins, and then, a metal line layer is arranged and solder balls are planted to lead lines to an external circuit. The three through holes of the packaging structure are of a sacrificial structure. Failure of lines in the three through holes is definitely failure of the line(s) in one or two of the holes on the two sides, while the line in the middle hole is intact. Therefore, the crack of the line layer can be effectively reduced, and the tensile stress on the two sides of the pins can be reduced. |
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Bibliography: | Application Number: CN20142376172U |