Housing heat radiation structure and electronic device

• Main Authors: CUI GUANGYONG, FU HONGYU
• Format: Patent
• Language: Chinese; English
• Published: 10.09.2014
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The utility model provides a housing heat radiation structure which is high in heat radiation efficiency with a simple structure, and an electronic device using the housing heat radiation structure. The housing heat radiation structure is applied to a housing plate which forms a housing. A heating component is disposed inside the housing. Multiple vents are formed in the housing plate. At least one sides of a part of the multiple vents are connected with heat radiation fins made of a stamped in-hole material. The heat radiation fins project towards the inner side of the housing. According to the housing heat radiation structure, the heat radiation area is increased through the arrangement of the heat radiation fins, the air circulation is guaranteed through the vents, and therefore the heat radiation efficiency is improved through the simple structure.