Mold guide device
Provided is a mold guide device which comprises a guide hole (2) in a mold body (1). A copper sleeve (3) is arranged in the guide hole (2). Compared with the prior art, due to the fact that the copper sleeve is arranged in the guide hole, the mold guide device enables a guide post to be connected wi...
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Main Authors | , , , , , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
13.03.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a mold guide device which comprises a guide hole (2) in a mold body (1). A copper sleeve (3) is arranged in the guide hole (2). Compared with the prior art, due to the fact that the copper sleeve is arranged in the guide hole, the mold guide device enables a guide post to be connected with the copper sleeve in a sliding mode; due to the fact that copper has tough and abrasion resistant characteristics and also has a certain lubricating function, when the guide post is connected with the copper sleeve in the sliding mode, a stuck phenomenon is not prone to be produced, abrasion does not easily occur, further mold combined precision in mold combination is guaranteed, and the finished product rate in production is improved; and meanwhile a seizure phenomenon does not easily occur, accordingly the phenomenon of mold damage or cracking can not occur, and therefore production continuity and stability are good, and service life of a mold is long. |
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Bibliography: | Application Number: CN20122400417U |