Method for attaching an optical filter to an encapsulated package

A method for attaching an optical device to an encapsulated electronic package. The method may include aligning and attaching an optical device to a non-singulated encapsulated electronic package using an adhesive, and curing the entire package. The method may further include singulating the non-sin...

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Bibliographic Details
Main Authors KEH KEAN L, OON CHIN H, LOKE CHAI L, CHIN YONG K
Format Patent
LanguageChinese
English
Published 04.05.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for attaching an optical device to an encapsulated electronic package. The method may include aligning and attaching an optical device to a non-singulated encapsulated electronic package using an adhesive, and curing the entire package. The method may further include singulating the non-singulated encapsulated electronic package with the optical device attached after curing.
Bibliography:Application Number: CN200610127802