Repairing damage to low-K dielectric materials using silylating agents

A method for restoring hydrophobicity to the surfaces of organosilicate glass dielectric films which have been subjected to an etchant or ashing treatment. These films are used as insulating materials in the manufacture of integrated circuits to ensure low and stable dielectric properties in these f...

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Bibliographic Details
Main Author BHANAP ANIL S.,RAMOS TERESA A.,IWAMOTO NANCY,LEUNG ROGER Y.,NAMAN ANANTH
Format Patent
LanguageEnglish
Published 27.09.2006
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