Resin sealing method for electronic part and mold used for the method

An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is...

Full description

Saved in:
Bibliographic Details
Main Author TAKASE SHINJI,TAMURA TAKASHI,ONISHI YOHEI
Format Patent
LanguageEnglish
Published 13.09.2006
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online AccessGet full text

Cover

Abstract An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.
AbstractList An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched between the lower mold and the middle mold and held under a prescribed tension to cover a cavity of the lower mold. A cavity side surface is also covered with the release film. Therefore, releasability of a cured resin from the cavity side surface is increased. As a result, the cured resin is prevented from being damaged near the cavity side surface.
Author TAKASE SHINJI,TAMURA TAKASHI,ONISHI YOHEI
Author_xml – fullname: TAKASE SHINJI,TAMURA TAKASHI,ONISHI YOHEI
BookMark eNqFyzsOwjAQRVEXUPBbA7MBCnCTlCgKoqJA9NHIfiGWnBnLNvunID3Vbc7dmpWoYGP6J0oQKuAY5E0z6qSeRs2ECFezSnCUOFdi8TRr9PQp-Ik6YRn2Zj1yLDgs3ZnjrX919xOSDiiJHQR16B7nxl4a217tf_EFDc8zrg
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID CN1832839A
GroupedDBID EVB
ID FETCH-epo_espacenet_CN1832839A3
IEDL.DBID EVB
IngestDate Fri Jul 19 15:29:35 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_CN1832839A3
Notes Application Number: CN200480022231
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060913&DB=EPODOC&CC=CN&NR=1832839A
ParticipantIDs epo_espacenet_CN1832839A
PublicationCentury 2000
PublicationDate 20060913
PublicationDateYYYYMMDD 2006-09-13
PublicationDate_xml – month: 09
  year: 2006
  text: 20060913
  day: 13
PublicationDecade 2000
PublicationYear 2006
RelatedCompanies TOWA CORP
RelatedCompanies_xml – name: TOWA CORP
Score 2.6542747
Snippet An upper mold, a lower mold, a middle mold, and a release film are used in a method of resin sealing of an electronic component. The release film is sandwiched...
SourceID epo
SourceType Open Access Repository
SubjectTerms AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Title Resin sealing method for electronic part and mold used for the method
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060913&DB=EPODOC&locale=&CC=CN&NR=1832839A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3NS8MwFH_MKepNpzK_c5Degpv9sociLm0Zgt0YU3YbbZOgoG2xHf77vqbt5mW3kC-SkF_e7yUv7wHc2XZsmpZwKDcEp4hESZFVD2kyjLklB0LISFn5htb4zXhZmIsOfLR_YZSf0F_lHBERlSDeS3Ve55tLLE_ZVhb38SdmZU_B3PW0tXZcubnUvJHrTyfehGmMuSzUwplb7VzkAs87sIsk2q6w4L-Pqj8p-X-BEhzB3hT7Sstj6Ii0BwesjbvWg_3X5rkbkw3yihPwZwK1elKZa6GwIXXgZ4KMk2wC2ZAc9wGJUk6-sy9OVoWoayDHaxqcwm3gz9mY4niW66kvWdgOXD-Dbpqlog9EF4YpEIeS6xFqc0nkJI40uDQfH-JIDpxz6G_r5WJ70SUc1tcLDh3qV9Atf1biGgVuGd-otfoDhxiG1A
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3NT8IwFH9BNOJNUYOf9GB2awS3MXdYjHRbpsIgZBpuZFvbYKKDyIj_vm8dH164Nf1K2_TX93vt63sAd5aVmGZH2JQbglNEoqTIqts0bSe8I1tCyFhZ-Yad4N14HZvjCkzXf2GUn9Bf5RwREZUi3nN1Xs-3l1iusq1c3CefmDV78iPH1TbaceHmUnO7jjccuAOmMeawUAtHTrFzkQs878E-EmyrwIL30S3-pMz_CxT_GA6G2FeWn0BFZHWosXXctToc9lfP3ZhcIW9xCt5IoFZPCnMtFDakDPxMkHGSbSAbMsd9QOKMk-_ZFyfLhShrIMdbNTiDpu9FLKA4nslm6hMWrgeun0M1m2WiAUQXhikQh5LrMWpzaWyntjS4NB8fkli27Ato7OrlcndRE2pB1O9Nei_h2xUclVcNNm3r11DNf5biBoVvntyqdfsDBU-Jxw
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Resin+sealing+method+for+electronic+part+and+mold+used+for+the+method&rft.inventor=TAKASE+SHINJI%2CTAMURA+TAKASHI%2CONISHI+YOHEI&rft.date=2006-09-13&rft.externalDBID=A&rft.externalDocID=CN1832839A