Polishing solution and method of polishing nonferrous metal materials
A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribut...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
14.09.2005
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| Edition | 7 |
| Subjects | |
| Online Access | Get full text |
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| Abstract | A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform. |
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| AbstractList | A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform. |
| Author | TSUCHIYA KAZUYO ARITA SATORU FUKUI HIROKAZU SUZUKI YOUICHIRO |
| Author_xml | – fullname: FUKUI HIROKAZU – fullname: SUZUKI YOUICHIRO – fullname: TSUCHIYA KAZUYO – fullname: ARITA SATORU |
| BookMark | eNrjYmDJy89L5WRwDcjPySzOyMxLVyjOzyktyczPU0jMS1HITS3JyE9RyE9TKIArAOpISy0qyi8tBkkn5ijkJpakFmUm5hTzMLCmAalUXijNzSDv5hri7KGbWpAfn1pckJicmpdaEu_sZ2hmZm5gbuZoTFgFAItANM4 |
| ContentType | Patent |
| DBID | EVB |
| DatabaseName | esp@cenet |
| DatabaseTitleList | |
| Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
| DeliveryMethod | fulltext_linktorsrc |
| Discipline | Medicine Chemistry Sciences |
| Edition | 7 |
| ExternalDocumentID | CN1667076A |
| GroupedDBID | EVB |
| ID | FETCH-epo_espacenet_CN1667076A3 |
| IEDL.DBID | EVB |
| IngestDate | Fri Jul 19 15:19:40 EDT 2024 |
| IsOpenAccess | true |
| IsPeerReviewed | false |
| IsScholarly | false |
| Language | English |
| LinkModel | DirectLink |
| MergedId | FETCHMERGED-epo_espacenet_CN1667076A3 |
| Notes | Application Number: CN200410075899 |
| OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050914&DB=EPODOC&CC=CN&NR=1667076A |
| ParticipantIDs | epo_espacenet_CN1667076A |
| PublicationCentury | 2000 |
| PublicationDate | 20050914 |
| PublicationDateYYYYMMDD | 2005-09-14 |
| PublicationDate_xml | – month: 09 year: 2005 text: 20050914 day: 14 |
| PublicationDecade | 2000 |
| PublicationYear | 2005 |
| RelatedCompanies | UYEMURA C. & CO., LTD |
| RelatedCompanies_xml | – name: UYEMURA C. & CO., LTD |
| Score | 2.626854 |
| Snippet | A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface... |
| SourceID | epo |
| SourceType | Open Access Repository |
| SubjectTerms | ADHESIVES CHEMISTRY DRESSING OR CONDITIONING OF ABRADING SURFACES DYES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PERFORMING OPERATIONS POLISHES POLISHING POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SKI WAXES TRANSPORTING |
| Title | Polishing solution and method of polishing nonferrous metal materials |
| URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20050914&DB=EPODOC&locale=&CC=CN&NR=1667076A |
| hasFullText | 1 |
| inHoldings | 1 |
| isFullTextHit | |
| isPrint | |
| link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3NS8MwFH_MKc6bTmV-5yC9FbsubbZDEZe2DMFuyJTdRtOkKEhXtor_vi_ZOr3sFvJFEvLy3u_lfQDcZ9JhmSMQ5PSYiwDFU7ZQbm6jMKdSlUtHSGMgm_ijN_o882YN-Kh9YUyc0B8THBEpKkN6r8x7Xf4psUJjW7l6EJ9YtXiMp0Fo1ehYsz9qhcMgmozDMbc4D3hiJa9B1_cZQvanPdhHIZppWojeh9onpfzPUOJjOJjgXEV1Ag1VtKHF67xrbTh82Xx3Y3FDeatTiLShmlEXkfq2kLSQZJ0BmixyUm47FMaLb4mYXjenXwSl0vVFO4O7OJrykY3rmW-3PudJvfDeOTRxuOoAoU6OfFn0FVMD6jI5SD1P-YhLqOwqP3cvoLNrlsvdTVdwZMKS6vQI9Bqa1fJb3SDDrcStOatfKwSHRg |
| link.rule.ids | 230,309,783,888,25576,76876 |
| linkProvider | European Patent Office |
| linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3NT8IwFH9BNOJNUYOf9GB2Wxyj2-SwGOm2TIVBzDTcln10wcSMBWb8930tDL1wa_qVtunre7_X9wFwl2aalWoJgpy-pSNAMbiacD1XUZjjMc8zLcmkgWxg-u_0ZWbMGjCvfWFknNAfGRwRKSpFeq_ke13-KbEcaVu5uk8-sWrx6IW2o9ToWLA_qjhD251OnAlTGLNZoARvds80LYTsT3uwjwK2JWjB_RgKn5TyP0PxjuFginMV1Qk0eNGGFqvzrrXhcLz57sbihvJWp-AKQzWpLiL1bSFxkZF1BmiyyEm57VBIL74lYnrRHH8RlErXF-0Mup4bMl_F9UTbrUcsqBfeP4cmDucdIFTLkS8nD9ziA6pb2SA2DG4iLqFZj5u5fgGdXbNc7m7qQssPx6No9By8XsGRDFEqUiXQa2hWy29-g8y3Sm7luf0CroSKOQ |
| openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Polishing+solution+and+method+of+polishing+nonferrous+metal+materials&rft.inventor=FUKUI+HIROKAZU&rft.inventor=SUZUKI+YOUICHIRO&rft.inventor=TSUCHIYA+KAZUYO&rft.inventor=ARITA+SATORU&rft.date=2005-09-14&rft.externalDBID=A&rft.externalDocID=CN1667076A |