Polishing solution and method of polishing nonferrous metal materials

A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribut...

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Bibliographic Details
Main Authors FUKUI HIROKAZU, SUZUKI YOUICHIRO, TSUCHIYA KAZUYO, ARITA SATORU
Format Patent
LanguageEnglish
Published 14.09.2005
Edition7
Subjects
ADHESIVES
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
TRANSPORTING
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Summary:A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10-1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal rate, so that distribution in film thickness becomes uniform.
Bibliography:Application Number: CN200410075899