Bond pad structure for cu process and its manufacture method

• Main Authors: LIN JIUNN-JYI, CAO MIN, TSENG HUANI, CHANG TZONG-SHENG, LEE YU-HUA, YANG CHIN-TIEN, LAI CHIA-HUNG
• Format: Patent
• Language: Chinese; English
• Published: 28.04.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention relates to a welding pad structure in the copper wiring process and the manufacturing method for the pad structure; wherein, the pad structure in copper wiring comprises a first protective layer, a second protective layer, and a plurality of pads. The first protective layer and the second layer are covered on a copper metal interconnected wire on the uppermost layer of a semiconductor substrate, and are provided with a plurality of openings for exposing the surface of the copper metal interconnected wire on the uppermost layer. The pads are formed above the openings on the firstprotective layer and interconnected with the surface of the copper metal interconnected wire on the uppermost layer, furthermore, two adjacent pads are isolated from each other by means of the secondprotective layer. The invention also provides the manufacturing method of forming the copper wiring pads. The welding pad has the advantages of preventing the short circuits among the pads, enhancingthereliability of integrate