Thermal management of power delivery systems for integrated circuits

• Main Authors: DUTTA ARINDUM, PANELLA AUGUSTO P, MCGRATH JAMES L
• Format: Patent
• Language: Chinese; English
• Published: 29.12.2004
• Edition: 7
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

一种用于向集成电路送电的系统，其包括去耦电容器，该去耦电容器位于形成为用于集成电路的插座或框架的连接器内。该送电系统采用集成到连接器内的电能储存器的形式，从而无需把复杂昂贵的电源迹线形成在与集成电路连接的电路板内或把分立电容器安装在该电路板上。该电能储存器集成到盖部件中，该盖部件装配在集成电路上面，并包含在内部分收纳集成电路的一部分的凹部。该盖部件包括至少一个通向集成电路工作表面的开口。由该盖部件支撑散热装置，例如翅片式散热器等，该散热装置贯穿它的开口与集成电路的发热表面接触以在工作期间使它冷却。 A system for delivering power to an integrated c...