Thermal management of power delivery systems for integrated circuits
一种用于向集成电路送电的系统,其包括去耦电容器,该去耦电容器位于形成为用于集成电路的插座或框架的连接器内。该送电系统采用集成到连接器内的电能储存器的形式,从而无需把复杂昂贵的电源迹线形成在与集成电路连接的电路板内或把分立电容器安装在该电路板上。该电能储存器集成到盖部件中,该盖部件装配在集成电路上面,并包含在内部分收纳集成电路的一部分的凹部。该盖部件包括至少一个通向集成电路工作表面的开口。由该盖部件支撑散热装置,例如翅片式散热器等,该散热装置贯穿它的开口与集成电路的发热表面接触以在工作期间使它冷却。 A system for delivering power to an integrated c...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
29.12.2004
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Edition | 7 |
Subjects | |
Online Access | Get full text |
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Abstract | 一种用于向集成电路送电的系统,其包括去耦电容器,该去耦电容器位于形成为用于集成电路的插座或框架的连接器内。该送电系统采用集成到连接器内的电能储存器的形式,从而无需把复杂昂贵的电源迹线形成在与集成电路连接的电路板内或把分立电容器安装在该电路板上。该电能储存器集成到盖部件中,该盖部件装配在集成电路上面,并包含在内部分收纳集成电路的一部分的凹部。该盖部件包括至少一个通向集成电路工作表面的开口。由该盖部件支撑散热装置,例如翅片式散热器等,该散热装置贯穿它的开口与集成电路的发热表面接触以在工作期间使它冷却。
A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents. |
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AbstractList | 一种用于向集成电路送电的系统,其包括去耦电容器,该去耦电容器位于形成为用于集成电路的插座或框架的连接器内。该送电系统采用集成到连接器内的电能储存器的形式,从而无需把复杂昂贵的电源迹线形成在与集成电路连接的电路板内或把分立电容器安装在该电路板上。该电能储存器集成到盖部件中,该盖部件装配在集成电路上面,并包含在内部分收纳集成电路的一部分的凹部。该盖部件包括至少一个通向集成电路工作表面的开口。由该盖部件支撑散热装置,例如翅片式散热器等,该散热装置贯穿它的开口与集成电路的发热表面接触以在工作期间使它冷却。
A system for delivering power to an integrated circuit includes a decoupling capacitance located in a connector that is formed as a socket, or frame for the IC. The power delivery system takes the form of a power reservoir that is integrated into a connector, thereby eliminating the need for complex and expensive power traces to be formed in or discrete capacitors mounted on a circuit board to which the IC is connected. The system includes a connector that takes the form of a cover member that fits over the IC and which contains a recess that accommodates a portion of the IC therein. The cover member includes at least a pair of spaced-apart capacitor plates that are disposed therewithin. Electricity is supplied to the plates so that they will become charged as a capacitor and the plates are formed with a plurality of terminals that extend into contact with the IC so that the plates may selectively discharge to the IC and thereby provide it with operating and surge currents. |
Author | PANELLA AUGUSTO P DUTTA ARINDUM MCGRATH JAMES L |
Author_xml | – fullname: DUTTA ARINDUM – fullname: PANELLA AUGUSTO P – fullname: MCGRATH JAMES L |
BookMark | eNqFyjsOwjAQBUAXUPA7A3sBigiCRIkCiIoqfWQ5L8GSvbZ2DSi3p6GnmmaWZsaJsTCX9gmJNlC0bEdEcKE0UE4fCPUI_g2ZSCctiEpDEvJcMIot6Ml5cS9fdG3mgw2Kzc-V2d6ubXPfIacOmq0Do3TNo6rrU3U8nPf_xxdEbjRf |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
DocumentTitleAlternate | 集成电路用送电系统的热管理 |
Edition | 7 |
ExternalDocumentID | CN1559164A |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_CN1559164A3 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 15:15:25 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | Chinese English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_CN1559164A3 |
Notes | Application Number: CN20028018929 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041229&DB=EPODOC&CC=CN&NR=1559164A |
ParticipantIDs | epo_espacenet_CN1559164A |
PublicationCentury | 2000 |
PublicationDate | 20041229 |
PublicationDateYYYYMMDD | 2004-12-29 |
PublicationDate_xml | – month: 12 year: 2004 text: 20041229 day: 29 |
PublicationDecade | 2000 |
PublicationYear | 2004 |
RelatedCompanies | MOLEX INC |
RelatedCompanies_xml | – name: MOLEX INC |
Score | 2.6066842 |
Snippet | ... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CURRENT COLLECTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
Title | Thermal management of power delivery systems for integrated circuits |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20041229&DB=EPODOC&locale=&CC=CN&NR=1559164A |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3fS8MwED7mFPVNpzJ_50H6VpxNa-tDEZe2DGHdkCl7G2uSssJsy9oh_vde6lp92VtIIFwSLneXfPcdwJ2pSNJiQ-hCRD3dtKnUHUuBHGlk9IRt8XlVDGYYPg7ezdepNW3Bos6FqXhCvypyRNQojvpeVvd1_veI5VXYyuI-SrArew4mrqfV0bH5YGAA7fVdfzzyRkxjzGWhFr656vcNI4OXHdhFJ9pW4C__o69yUvL_BiU4gr0xzpWWx9CSaQcOWF13rQP7w813NzY3mlecgIfniXfoknw2eBWSxSRXRc6IkEsFr_gmv7zMBUFPlDREEILwZMXXSVmcwm3gT9hAR3FmzcpnLKzlpmfQTrNUdoGgA2JKg4qYzrmJ_o3DLSFsKhyVEU45PYfutlkutg9dwmHNYWg8XUG7XK3lNdrbMrqptuoH6AqF6g |
link.rule.ids | 230,309,783,888,25578,76884 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwdV3dT8IwEL8gGvFNUYOf9MHwtohr5-bDYqRjQYVBDBreCGu7QIJjYSPG_97rZOgLb02bXK5t7qu9-x3ADdMgaZEpDSnDpsFsqgzH0kmONDSb0rbEJG8G0wvuO-_sZWSNSjAtamFynNCvHBwRJUqgvGe5vk7-HrG8PLcyvQ1nOLV49Ieu1yiiY3ZnYgDttdz2oO_1eYNzlweN4M3Vv28YGTztwC462I5G2W9_tHRNSvLfoPiHsDdAWnF2BCUVV6HCi75rVdjvrb-7cbiWvPQYPLxP1KFz8rnJVyGLiCS6yRmRaq7TK77JLy5zStATJRsgCEnEbClWsyw9gbrfHvKOgeyMNzsf86Dgm55COV7EqgYEHRCmTCojOhEM_RtHWFLaVDq6IpwKega1bVTOty_VodIZ9rrj7nPwegEHBZ6h-XAJ5Wy5Uldoe7PwOj-2H1eTiNo |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Thermal+management+of+power+delivery+systems+for+integrated+circuits&rft.inventor=DUTTA+ARINDUM&rft.inventor=PANELLA+AUGUSTO+P&rft.inventor=MCGRATH+JAMES+L&rft.date=2004-12-29&rft.externalDBID=A&rft.externalDocID=CN1559164A |