Sputtering target material

• Main Authors: SHODA SOMEI, HARA NORIAKI, MATSUSAKA NORIYA
• Format: Patent
• Language: Chinese; English
• Published: 06.10.2004
• Edition: 7
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A sputtering target material made of moble metal features that it has the columnar crystal structure grown in the normal direction opposite to sputtering surface. Its advantages are high purity, little inner defect, and providing better film characteristic. 本发明是由贵金属构成的溅射靶材，其特征在于，具有相对于溅射面沿法线方向生长的柱状结晶组织，本发明解决了具有该特征的溅射靶材的问题。本发明不产生由熔解铸造法或粉末冶金法得到的溅射靶材产生的微小成堆块状体脱落的问题，是能够得到良好薄膜特性、同时内部缺陷极少的高纯度溅射用贵金属靶材。