Preparation method of silver-based active solder foil

• Main Authors: YAO ZHIYUAN, HE HAORAN, BO XINWEI, WANG YUJIN, LIU QI, WANG XIAOYU, HAN XIAOYU, REN BINGLANG
• Format: Patent
• Language: Chinese; English
• Published: 05.07.2024
• Subjects: CASTING; MAKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; PERFORMING OPERATIONS; POWDER METALLURGY; TRANSPORTING; WORKING METALLIC POWDER

The invention relates to a preparation method of a silver-based active solder foil. According to the method, alloy powder is prepared through vacuum melting and atomization; after the melting point temperature of the alloy powder is measured, the alloy powder and titanium powder are mixed, formed, sintered, hot-rolled, subjected to surface treatment and cold-rolled to the thickness of a finished product, and then annealing is conducted; by the adoption of the method, after silver and one or more elements of copper, gold, tin, lead and indium are subjected to vacuum melting and atomization to prepare alloy powder, the alloy powder is mixed with titanium powder, sintering and hot rolling are carried out at the temperature (600 DEG C) lower than that of a traditional process, generation of brittle intermetallic compounds is effectively avoided, densification of an alloy blank is achieved, and the alloy blank is prepared into the titanium alloy. The defects of brittle failure, cracking and the like cannot occur a