FeCoNi-based medium-entropy alloy film with high thermoelectric performance and preparation method of FeCoNi-based medium-entropy alloy film
The invention discloses a FeCoNi-based medium-entropy alloy film with high thermoelectric performance and a preparation method of the FeCoNi-based medium-entropy alloy film, in the FeCoNi-based medium-entropy alloy film, the molar ratio of Fe to Co to Ni is 90: (20-60): (20-60); the thickness of the...
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Main Authors | , , , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
28.06.2024
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a FeCoNi-based medium-entropy alloy film with high thermoelectric performance and a preparation method of the FeCoNi-based medium-entropy alloy film, in the FeCoNi-based medium-entropy alloy film, the molar ratio of Fe to Co to Ni is 90: (20-60): (20-60); the thickness of the medium-entropy alloy film is 400-600 nm, the Seebeck coefficient is 300-400 [mu] V/K, and the conductivity is 104-105 S/m. The FeCoNi-based medium-entropy alloy film is prepared through the electron beam evaporation technology and annealing treatment, the obtained medium-entropy alloy film has high thermoelectric performance and excellent mechanical performance, and good adhesive force is achieved between the medium-entropy alloy film and a base body.
本发明公开了一种具有高热电性能的FeCoNi基中熵合金薄膜及其制备方法,FeCoNi基中熵合金薄膜中,Fe、Co和Ni的摩尔比为90:20-60:20-60;中熵合金薄膜的厚度为400-600nm,塞贝克系数为300-400μV/K,电导率为104-105S/m。本发明利用电子束蒸镀技术及退火处理制备出FeCoNi基中熵合金薄膜,所得中熵合金薄膜具有高热电性能和优异的力学性能,并且与基体之间具有良好的附着力。 |
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Bibliography: | Application Number: CN202410402278 |