Manifold, cabinet and data center cooling system

• Main Authors: LIU ZONGLIN, DING YUJIA
• Format: Patent
• Language: Chinese; English
• Published: 07.05.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a manifold, a cabinet and a data center cooling system. The manifold comprises a water inlet pipe, a water outlet pipe, a plurality of first inlet and outlet sets and a plurality of second inlet and outlet sets. The water outlet pipe is parallel to the water inlet pipe, each first inlet-outlet set comprises a first water inlet and a first water outlet, each second inlet-outlet set comprises a second water inlet and a second water outlet, and the first inlet-outlet sets and the second inlet-outlet sets are arranged on the two opposite sides of the water inlet pipe and the water outlet pipe respectively. The distance between every two adjacent first inlet and outlet groups is a first preset distance, the distance between every two adjacent second inlet and outlet groups is a second preset distance, and the first preset distance is not equal to the second preset distance. According to the manifold, the cabinet and the data center cooling system, when the layer height of the cabinet changes