Semiconductor device

• Main Authors: KATO NOBUYUKI, TOMATSU YUTAKA
• Format: Patent
• Language: Chinese; English
• Published: 19.04.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

In a semiconductor device in which a semiconductor chip (10) is sealed in a molding resin (60), the semiconductor chip (10) has a cell region (11) in which a semiconductor element is formed and an outer peripheral region (12) surrounding the cell region (11), and a protective film (140) is formed in the outer peripheral region (12) on one surface (100a) side of a semiconductor substrate (100). Furthermore, the surface roughness of the surface (141) of the protective film (140) on the side opposite to the semiconductor substrate (100) side is 5 nm or more, and a concave-convex structure (150) is formed on the surface (141). 在将半导体芯片(10)密封于模塑树脂(60)的半导体装置中，半导体芯片(10)具有形成有半导体元件的单元区域(11)以及将单元区域(11)包围的外周区域(12)，在半导体衬底(100)的一面(100a)侧，在外周区域(12)形成保护膜(140)。并且，关于保护膜(140)，与半导体衬底(100)侧相反的一侧的表面(141)的表面粗糙度为5nm以上，并且在表面(141)形成有凹凸构造(150)。