Camera module for heat dissipation and grounding and electronic device including same

• Main Authors: ZHAO MINQI, KIM JUNG-SOO, JUNG WON-JUN, KIM TAE-YOON, CHOI KWANG-SIK, AJIMA SATOSHI, XU CONGYU, CHO WONUL
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2024
• Subjects: ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; PICTORIAL COMMUNICATION, e.g. TELEVISION

A camera module according to an embodiment includes: a printed circuit board including a conductive pad exposed on one surface thereof; an image sensor disposed on the printed circuit board; a conductive plate disposed between the printed circuit board and the image sensor, and electrically connected to the conductive pad; an actuator disposed on the image sensor and configured to adjust a position of the lens assembly; and a shielding case surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to dissipate heat generated from the image sensor to the outside of the camera module by coming into contact with the image sensor. 根据实施方式的相机模块包括：印刷电路板，包括暴露在其一个表面上的导电焊盘；图像传感器，设置在印刷电路板上；导电板，设置在印刷电路板和图像传感器之间，并且电连接到导电焊盘；致动器，设置在图像传感器上，并且配置成调节镜头组件的位置；以及屏蔽罩，围绕致动器，并且电连接到导电板。导电板配置成通过与图像传感器接触而将从图像传感器生成的热量散发到相机模块的外部。