Chemical tin immersion composite solution, tin immersion process and application of chemical tin immersion composite solution

• Main Authors: LU WENXIN, DU TENGHUI, TAN WENLING
• Format: Patent
• Language: Chinese; English
• Published: 16.04.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRINTED CIRCUITS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to the field of surface treatment of printed circuit boards, and discloses a chemical tin immersion composite solution, a tin immersion process and application of the chemical tin immersion composite solution. The chemical tin immersion composite solution comprises a tin immersion basic agent, a tin immersion correcting agent, a SnTeck tin solution, special acid SF and a tin immersion additive. The chemical tin immersion process comprises the steps that acid oil removal, micro-etching, presoaking, chemical tin immersion, post tin immersion, water washing and anti-oxidation washing are sequentially conducted on a plate to be treated, the chemical tin immersion composite solution is adopted for presoaking, chemical tin immersion and post tin immersion, the chemical tin immersion composite solution has excellent tinning performance and tin whisker inhibition capacity, and in the storage process of a prepared tin immersion layer, the thickness of the prepared tin immersion layer is smaller t