Circuit board back hole drilling method and circuit board through hole scanning method

• Main Author: JIAN ZHENQI
• Format: Patent
• Language: Chinese; English
• Published: 09.04.2024
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

In the prior art, the openings of the through holes of the circuit board are scanned one by one, and the scanning process needs to consume a quite long time. Therefore, the invention provides a circuit board back hole drilling method, which comprises the following steps of: providing a drilling machine platform which comprises a drilling tool and an image acquisition module, and the drilling tool is electrically connected with the image acquisition module; wherein the image acquisition module scans a plurality of scanning areas on the upper surface of the circuit board for multiple times to obtain a plurality of target images, each scanning area at least comprises a through hole to be drilled with a back hole, and the scanning areas do not all comprise only one through hole to be drilled with the back hole. In this way, the positions of the openings of all the through holes in the circuit board can be obtained within a short time. The invention further provides a circuit board through hole scanning method. 本发