Multiple dies coupled with glass core substrate

• Main Authors: GANESAN SANKA, IBRAHIM TAHER A, MORTENSEN RASMUS, COLLINS ARLAN, PIETAMBARAM SRINIVAS V
• Format: Patent
• Language: Chinese; English
• Published: 23.02.2024
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments described herein may be directed to apparatuses, processes, and techniques related to a package that includes one or more dies coupled with one or more glass layers. These glass layers may be within an interposer or patch to which the one or more dies are attached. In addition, these glass layers may be used to facilitate a pitch transition between one or more dies adjacent a first side of the glass layer and a substrate adjacent a second side of the glass layer opposite the first side, the one or more dies being electrically coupled to the substrate. Other embodiments may be described and/or claimed. 本文描述的实施例可以涉及与封装相关的设备、工艺和技术，所述封装包括一个或多个管芯，所述管芯与一个或多个玻璃层耦接。这些玻璃层可以在所述一个或多个管芯所附接到的内插器或贴片之内。另外，这些玻璃层可以用于有助于在邻近所述玻璃层第一侧的一个或多个管芯与邻近所述玻璃层的与所述第一侧相对的第二侧的衬底之间的间距转换，所述一个或多个管芯电耦接到所述衬底。可以描述其他实施例和/或主张对所述其他实施例的保护。